BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs

This book is for PCB designers who are designing boards with multiple very large Ball Grid Array (BGA) packages. It explores the impact of dense BGAs with high pin-count on PCB design and provides solutions for the inherent design challenges. Though you may not yet have been confronted with the difficulties of routing BGAs and the impact on fabrication costs and signal integrity, this book will reveal these potential pitfalls as well as methods to mitigate these problems.
Contents
Preface - Second Edition  v
Chapter One - Introduction  1
Chapter Two - BGA Packages  17
Chapter Three - HDI Layer Stackups  25
Chapter Four - Fanout Patterns  55
Chapter Five - Layer Biased Breakouts  95
Chapter Six - 0.8mm Pin-Pitch BGA Tests  121
Chapter Seven - Software for Generating BGA Fanouts  165
Conclusion  175
About the Author  177